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Microelectronic Packaging Technology: Materials And Processes : Proceedings Of The 2nd Asm International Electronic Materials And Processing Congres
Publisher: Asm Intl
SKU: DADAX0871703599
Condition : New
SKU: DADAX0871703599
Condition : New
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$1,234.57
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Microelectronic Packaging Technology: Materials and Processes : Proceedings of the 2nd Asm International Electronic Materials and Processing Congres
Features of Microelectronic Packaging Technology: Materials and Processes : Proceedings of the 2nd Asm International Electronic Materials and Processing Congres
Used Book in Good Condition
Specification of Microelectronic Packaging Technology: Materials and Processes : Proceedings of the 2nd Asm International Electronic Materials and Processing Congres
| GENERAL | |
|---|---|
| Author | Shieh, W. T. |
| Binding | hardcover |
| Language | english |
| Edition | First Edition |
| ISBN-10 | 0871703599 |
| ISBN-13 | 9780871703590 |
| Publication Year | 1989-01-01T00:00:00Z |
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