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Through Silicon Vias: Materials, Models, Design, and Performance,Used Through Silicon Vias: Materials, Models, Design, and Performance,Used
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Through Silicon Vias: Materials, Models, Design, and Performance,Used
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a...
Sale price$269.75 Regular price$385.36
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