Carbon Nanotubes for Interconnects: Process, Design and Applications,Used

Carbon Nanotubes for Interconnects: Process, Design and Applications,Used

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SKU: DADAX3319297449
Brand: Springer
Condition: New
Regular price$123.14
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This book provides a singlesource reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, onchip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect throughsilicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal onchip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a mustread for anyone interested in the stateoftheart on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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