Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series),Used

Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series),Used

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SKU: SONG0750692677
UPC: 9780750692670
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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surfacemount packages, hermetic packages, and advanced designs such as flipchip, chiponboard and multichip models.

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This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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