Title
ChemicalMechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Applica,New
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As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a lowdielectric constant (lowkappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemicalmechanical planarization (CMP) process used in Damascene patterning. Lowkappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and lowkappa CMP to develop a comprehensive mechanism for low and highremovalrate processes. The result is a more indepth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multimaterial structure during Damascene patterning.
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