Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology),Used

Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology),Used

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SKU: SONG9814451207
Brand: Springer
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Integrated circuit (IC) reliability is of increasing concern in presentday IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3dimensional (3D) electrothermostructural model as opposed to the conventional current density based 2dimensional (2D) models is presented at circuitlayout level.

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This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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