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This is an authoritative reference source of practical information on the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgment of 407 expert microelectronics packaging authors, coauthors, and reviewers. This multiauthor approach ensures the best, most timely information throughout. Panels of experts reviewed each article for technical accuracy, generic point of view, and completeness. A glossary of terms and definitions common to this field will be a much used reference source. Sections: Design and Materials Component and Discrete Chip Mounting Technologies Hybrids and HigherLevel Integration Packages Printed Wiring Boards Soldering and Mounting Technology Conformal Coatings and Encapsulants Quality Control, Quality Assurance, and Electrical Evaluation Failure Analysis Advanced Composite Packaging Materials. Published: 1989 Pages: 1224 Format: Hardbound Published: August 20, 1989 ISBN: 9780871702852
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This product may contain chemicals known to the State of California to cause cancer,
birth defects, or other reproductive harm.
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⚠️ California Proposition 65 Warning: Some products sold on this website may expose you to chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information, visit www.P65Warnings.ca.gov.