Electronic Packaging And Interconnection Handbook

Electronic Packaging And Interconnection Handbook

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Covering Every Aspect Of Electronic Packaging From Development And Design To Manufacturing, Facilities, And Testing, Electronic Packaging And Interconnection Handbook,Third Edition, Continues To Be The Standard Reference In Its Field. Here, In This Single Informationpacked Resource Are All The Data And Guidelines You Need For All Types And Levels Of Electronic Packages, Interconnection Technologies, And Electronic Systems. No Other Book Treats All Of The Subjects Covered In This Handbook In Such An Integrated And Interrelated Manner, A Treatment Designed To Help You Achieve A More Reliable, More Manufacturable, And More Costeffective Electronic Package.Here'S Everything You Need To Know About Materials, Thermal Management, Mechanical And Thermomechanical Stress Behavior, Wiring And Cabling, Soldering And Solder Technology, Integrated Circuit Packaging, Surface Mount Technologies, Rigid And Flexible Printed Wiring Boards. And With Over 60% New Material, This Third Edition Brings You Thoroughly Up To Speed On A New Generation Of Packaging Technologies: Single Chip Packaging...Ball Gridarrays...Chip Scale Packaging...Lowcost Flip Chiptechnologies...Direct Chip Attach, And More.

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To facilitate a smooth return process, a Return Authorization (RA) Number is required for all returns. Returns without a valid RA number will be declined and may incur additional fees. You can request an RA number within 15 days of the original delivery date. For more details, please refer to our Return & Refund Policy page.

Shipping & Returns

Shipping
We ship your order within 2–3 business days for USA deliveries and 5–8 business days for international shipments. Once your package has been dispatched from our warehouse, you'll receive an email confirmation with a tracking number, allowing you to track the status of your delivery.

Returns
To facilitate a smooth return process, a Return Authorization (RA) Number is required for all returns. Returns without a valid RA number will be declined and may incur additional fees. You can request an RA number within 15 days of the original delivery date. For more details, please refer to our Return & Refund Policy page.

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Warranty

We provide a 2-year limited warranty, from the date of purchase for all our products.

If you believe you have received a defective product, or are experiencing any problems with your product, please contact us.

This warranty strictly does not cover damages that arose from negligence, misuse, wear and tear, or not in accordance with product instructions (dropping the product, etc.).

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Frequently Asked Questions

  • Q: What topics does the Electronic Packaging and Interconnection Handbook cover? A: The handbook covers a wide range of topics related to electronic packaging, including development and design, manufacturing processes, facilities, testing, materials, thermal management, mechanical stress behavior, wiring and cabling, soldering technologies, integrated circuit packaging, surface mount technologies, and printed wiring boards.
  • Q: Who is the author of the Electronic Packaging and Interconnection Handbook? A: The author of the handbook is Charles A. Harper.
  • Q: How many pages does the third edition of the handbook contain? A: The third edition of the Electronic Packaging and Interconnection Handbook contains 992 pages.
  • Q: What is the publication date of the Electronic Packaging and Interconnection Handbook? A: The handbook was published on February 18, 2000.
  • Q: Is the Electronic Packaging and Interconnection Handbook suitable for beginners? A: Yes, the handbook is comprehensive and provides valuable information for both beginners and experienced professionals in the field of electronic packaging.
  • Q: What is the binding type of this handbook? A: The Electronic Packaging and Interconnection Handbook is available in hardcover binding.
  • Q: Does this edition include updated information on packaging technologies? A: Yes, the third edition includes over 60% new material, covering advancements in packaging technologies such as single chip packaging, ball grid arrays, chip scale packaging, and low-cost flip chip technologies.
  • Q: What condition is the book in if listed as 'Very Good'? A: 'Very Good' condition means the book is gently used, with minimal wear and no significant damage, making it suitable for reading and reference.
  • Q: Can this handbook be used as a reference for manufacturing electronic systems? A: Yes, the handbook serves as a standard reference for manufacturing electronic systems, providing guidelines and data necessary for various levels of electronic packages.
  • Q: What makes this handbook unique compared to other resources? A: This handbook uniquely integrates various subjects related to electronic packaging and interconnection technologies, offering a cohesive understanding that enhances the reliability and manufacturability of electronic packages.