Electronic Packaging And Interconnection Handbook 4/E,New

Electronic Packaging And Interconnection Handbook 4/E,New

In Stock
SKU: DADAX0071430482
UPC: 639785511328
Brand: Mcgraw-Hill Education
$175.23
Quantity
Add to wishlist
Add to compare

Processing time: 1-3 days

US Orders Ships in: 3-5 days

International Orders Ships in: 8-12 days

Return Policy: 15-days return on defective items

Payment Option
Payment Methods

Help

If you have any questions, you are always welcome to contact us. We'll get back to you as soon as possible, withing 24 hours on weekdays.

Customer service

All questions about your order, return and delivery must be sent to our customer service team by e-mail at yourstore@yourdomain.com

Sale & Press

If you are interested in selling our products, need more information about our brand or wish to make a collaboration, please contact us at press@yourdomain.com

Publisher'S Note: Products Purchased From Third Party Sellers Are Not Guaranteed By The Publisher For Quality, Authenticity, Or Access To Any Online Entitlements Included With The Product.The Most Comprehensive Reference In Electronic Packagingcompletely Updatedfrom New Materials And Technologies To Increasingly Prevalent Leadfree Manufacturing Practices, Electronic Packaging And Interconnection Handbook Offers A Unique Source Of Key Reference Data, Practical Guidance, And Circuit And Package Design Basics. Through Three Bestselling Editions, This Classic Reference Has Served Those Involved In The Design, Manufacture, Testing, And Use Of All Types Of Electronic Packaging, Becoming The Most Widely Used Reference In The Industry. This Thoroughly Revised And Expanded Fourth Edition Adds New Information On Key Mems; Optoelectronic, Singlechip, And Highspeed Technologies; And Updates Important Chapters On Ball Grid Array And Flip Chip Technologies.Of Interest To Mechanical And Electrical Engineers, Chemists, Physicists, And Materials Scientists In All Areas Of The Electronic Packaging Industry, The Book Takes A Unique Interdisciplinary Approach To The Field, Allowing Specialists In One Area To Understand The Needs And Responsibilities Of Others.Whether Your Area Of Expertise Is Design And Manufacturing, Quality Control, Or Marketing, It'S Easy To See Why The Fourth Edition Of The Electronic Packaging And Interconnection Handbook Makes An Excellent Addition To Your Reference Arsenal.Written By A Team Of Experts From Around The Globe, This Remarkable Volume Covers All Aspects Of Electronic Packaging, Including: Materials Thermal Management Shock, Vibration, And Operational Stress Management Connector And Interconnection Technologies Soldering And Cleaning Technologies Single Chip Packaging And Ball Grid Arrays Surface Mount Technology Hybrid And Multichip Modules Chipscale, Flipchip, And Directchip Attachment Rigid And Flexible Printedwiring Boards Packaging Highspeed And Microwave Systems Packaging Highvoltage Systems Packaging Of Mems Systems Packaging Of Optoelectronic Systems

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

Recently Viewed