Title
Fundamentals of Microsystems Packaging,Used
Processing time: 1-3 days
US Orders Ships in: 3-5 days
International Orders Ships in: 8-12 days
Return Policy: 15-days return on defective items
Payment Option
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UPWritten by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find:*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology*Easytoread schematics and block diagrams*Fundamental approaches to all system issues*Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, optoelectronic, microvia boards, thermal and others*Details on chiptoboard connections, sealing and encapsulation, and manufacturing processes*Basics of electrical and reliability testing
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.
- Q: What is the main focus of 'Fundamentals of Microsystems Packaging'? A: The book focuses on providing a comprehensive understanding of microsystems packaging, covering technologies from wafer to systems, including key aspects of microelectronics, photonics, RF, and packaging design.
- Q: Who is the author of this book? A: The author is Rao Tummala, a leading expert in the field of microsystems packaging.
- Q: How many pages does the book have? A: The book has 967 pages, offering an in-depth exploration of the subject matter.
- Q: What edition of the book is available? A: The available edition is the first edition, published on May 29, 2001.
- Q: What are some key topics covered in this book? A: Key topics include electrical, mechanical, chemical, and materials aspects of packaging technologies, as well as details on chip-to-board connections, sealing, encapsulation, and manufacturing processes.
- Q: Is the book suitable for beginners in microsystems packaging? A: Yes, the book provides a rigorous and thorough introduction to the field, making it accessible for beginners while also being valuable for experienced professionals.
- Q: What type of diagrams are included in the book? A: The book includes easy-to-read schematics and block diagrams to help illustrate complex concepts.
- Q: What is the item condition of the book? A: The item is in good condition, suitable for readers looking for a comprehensive resource.
- Q: Can this book assist with understanding reliability testing in packaging? A: Yes, the book includes fundamental approaches to reliability testing, making it a useful resource for understanding this critical aspect of packaging.
- Q: What technologies are discussed in terms of packaging configurations? A: The book discusses various packaging configurations, including wafer level packaging, single chip, multichip, RF, opto-electronic, and microvia boards.