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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series),Used
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Achieving costeffective performance over time requires an organized, disciplined, and timephased approach to product design, development, qualification, manufacture, and inservice management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss: failure sites, operational loads, and failure mechanismintrinsic device sensitivitieselectromigrationhot carrier agingtime dependent dielectric breakdownmechanical stress induced migrationalpha particle sensitivityelectrostatic discharge (ESD) and electrical overstresslatchupqualificationscreeningguidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.