High Speed End Milling of Single Crystal Silicon Wafer: An Economic Method of Machining of Silicon in Ductile Mode,Used

High Speed End Milling of Single Crystal Silicon Wafer: An Economic Method of Machining of Silicon in Ductile Mode,Used

In Stock
SKU: DADAX3844381112
Brand: LAP Lambert Academic Publishing
Sale price$84.81 Regular price$121.16
Save $36.35
Quantity
Add to wishlist
Add to compare

Processing time: 1-3 days

US Orders Ships in: 3-5 days

International Orders Ships in: 8-12 days

Return Policy: 15-days return on defective items

Payment Option
Payment Methods

Help

If you have any questions, you are always welcome to contact us. We'll get back to you as soon as possible, withing 24 hours on weekdays.

Customer service

All questions about your order, return and delivery must be sent to our customer service team by e-mail at yourstore@yourdomain.com

Sale & Press

If you are interested in selling our products, need more information about our brand or wish to make a collaboration, please contact us at press@yourdomain.com

Machining of single crystal silicon is a challenging and expensive affair due to the high hardness and inherent brittleness of the material. Major problem in conventional machining of brittle materials like silicon is the generation of cracks and subsurface damages. This book outlines a ductile mode machining process developed for silicon employing high speed end milling using diamond coated tools. The developed method was found to ensure integrity of the machined surface and good surface finish. The influence of the cutting parameters, such as, cutting speed, feed and depth of cut, on ductile mode machining are discussed in the book. A 3level full factorial design of experiments using Response Surface Methodology (RSM) was employed to develop regression model of average surface roughness. The developed model was tested using Analysis of Variance (ANOVA) at 95% confidence level. The best average surface roughness achieved was 0.2m, which could alleviate the need for further grinding and rough polishing operations to save cost and cycle time of machining silicon.

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

Recently Viewed