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HighFrequency Characterization of Electronic Packaging will be of interest to researchers and designers of highfrequency electronic packaging. Understanding highfrequency behavior of packaging is of growing importance due to higher clockspeeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the highfrequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.HighFrequency Characterization of Electronic Packaging gives the reader an insight into how highfrequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern ICpackages and in determination of circuit models.HighFrequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing highfrequency measurements. Important notions in high frequency characterization such as Sparameters, calibration, probing, deembedding and measurementbased modeling are explained. The described techniques are illustrated with several uptodate examples.
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