Title
HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS,Used
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In any structural component where load path is diverted due to a change in section, i.e. a delaminated composite component, an adhesively bonded joint or ply dropoffs, and where outof plane stresses are induced, component surface displacements will occur. These outofplane surface displacements although relatively small, are indicative of internal structural problems that can be associated with component strength capacity limitations. This book discusses the application of a portable holographic interferometry testing system (PHITS) to study microdeformations of a surface in a wide range of structural defects. The defects covered include delaminations, matrix cracks and matrix degradation due to heat, peel displacement behaviour in bonded lapjoints, debonded and weak bondlines. The results of this optical investigation have extended structural behaviour and mechanics understanding in all of the defect interaction.
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.