Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging,Used

Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging,Used

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SKU: SONG0367573660
UPC: 9780367573669
Brand: CRC Press
Condition: Used
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Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the highspeed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the fieldcircuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the deembedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and twodimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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