Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging,Used

Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging,Used

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Modeling and Design of Electromagnetic Compatibility for HighSpeed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the highspeed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the fieldcircuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the deembedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and twodimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

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We provide a 2-year limited warranty, from the date of purchase for all our products.

If you believe you have received a defective product, or are experiencing any problems with your product, please contact us.

This warranty strictly does not cover damages that arose from negligence, misuse, wear and tear, or not in accordance with product instructions (dropping the product, etc.).

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