MorethanMoore 2.5D and 3D SiP Integration,Used

MorethanMoore 2.5D and 3D SiP Integration,Used

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SKU: DADAX3319849328
Brand: Springer
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moores Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a mustread for any IC product team that is considering getting off the Moores Law track, and leveraging some of the MorethanMoore technology options for their next microelectronic product.

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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