Title
NetworkonChip Architectures: A Holistic Design Exploration (Lecture Notes in Electrical Engineering, 45),Used
Sold by Ergodebooks, an authorized reseller.
Returns accepted within 30 days | support@ergodebooks.com
Shipping Information
- Free Standard Shipping — United States only
- Processing Time: 1–3 business days
- Estimated Delivery: 3–5 business days after dispatch
- Double-boxed, fully insured & discreetly packaged
- Tracking number sent via email once dispatched
- Orders over $250 require signature upon delivery. Taxes calculated at checkout.
Returns & Refund
Returns accepted within 30 days of delivery.
Damaged or Defective Item
Free return shipping + replacement or full refund
Wrong Item Received
Free return shipping + replacement or full refund
Change of Mind
Return shipping at customer's expense · 25% restocking fee applies
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intels very recently announced 80core TeraFLOP chip [5] exemplifies the irreversible march toward manycore systems with tens or even hundreds of processing elements. 1.2 The Dawn of the CommunicationCentric Revolution The multicore thrust has ushered the gradual displacement of the computati centric design model by a more communicationcentric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p cessing elements working in tandem. This trend has led to a surge in the popularity of multicore systems, which typically manifest themselves in two distinct incarnations: heterogeneous MultiProcessor SystemsonChip (MPSoC) and homogeneous Chip MultiProcessors (CMP). The SoC philosophy revolves around the technique of PlatformBased Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced TimeTo Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of preexisting IP components integrated on a single die.
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.