Semiconductor Device Modeling with Spice,New

Semiconductor Device Modeling with Spice,New

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The second edition contains updated and expanded coverage of how to use Simulation Program with Integrated Circuit Emphasis, and SPICEbased programs, to simulate and predict the performance of electronic circuits. Features description of the device models themselves rather than simply instruction on how to run SPICE software. Annotation copyright Book News, Inc. Portland, Or.

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To facilitate a smooth return process, a Return Authorization (RA) Number is required for all returns. Returns without a valid RA number will be declined and may incur additional fees. You can request an RA number within 15 days of the original delivery date. For more details, please refer to our Return & Refund Policy page.

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We provide a 2-year limited warranty, from the date of purchase for all our products.

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This warranty strictly does not cover damages that arose from negligence, misuse, wear and tear, or not in accordance with product instructions (dropping the product, etc.).

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Frequently Asked Questions

  • Q: What is the main focus of 'Semiconductor Device Modeling with Spice'? A: The book primarily focuses on using SPICE-based programs to simulate and predict the performance of electronic circuits, with an emphasis on device models rather than just instructions on running the software.
  • Q: Who is the author of this book? A: The author of 'Semiconductor Device Modeling with Spice' is Paolo Antognetti.
  • Q: How many pages does this book contain? A: This book contains 479 pages.
  • Q: What is the condition of this book? A: The book is listed in 'Good' condition, indicating it may show some signs of wear but is still usable.
  • Q: When was 'Semiconductor Device Modeling with Spice' published? A: The book was published on April 1, 1993.
  • Q: Is this book suitable for beginners? A: While the book provides detailed descriptions of device models and SPICE usage, it may be more beneficial for those with some prior knowledge of semiconductor devices and circuit simulation.
  • Q: What binding type does this book have? A: This book is available in hardcover binding.
  • Q: Does the book include updated content? A: Yes, the second edition includes updated and expanded coverage of the relevant topics in semiconductor device modeling.
  • Q: What is the edition of this book? A: This book is a subsequent edition.
  • Q: What category does this book fall under? A: The book is categorized under Software Design, Testing & Engineering.