Title
Thermal Management of Microelectronic Equipment (Asme Press Book Series on Electronic Packaging),Used
Processing time: 1-3 days
US Orders Ships in: 3-5 days
International Orders Ships in: 8-12 days
Return Policy: 15-days return on defective items
Payment Option
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a stepbystep analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. LianTuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.
- Q: What is the main focus of the book 'Thermal Management of Microelectronic Equipment'? A: The book focuses on practical design problems related to thermal management in electronic packaging, emphasizing heat transfer technologies from chip to system levels.
- Q: Who are the authors of this book? A: The authors of the book are Lian-Tuu Yeh and Richard Chu, both recognized experts in thermal management with a combined 60 years of industry experience.
- Q: What type of information can I expect to find in this book? A: The book includes substantial practical design data, empirical correlations, a comprehensive convective heat transfer catalog, and property tables of solids and fluids.
- Q: Is this book suitable for beginners in the field of thermal management? A: Yes, the book provides a step-by-step analysis approach to engineering, making it accessible for beginners while also being a valuable reference for experienced professionals.
- Q: What is the condition of the book being sold? A: The book is listed as 'New', ensuring that it is in excellent condition for readers.
- Q: How many pages does this book contain? A: The book contains a total of 414 pages.
- Q: What is the binding type of this book? A: The book is available in hardcover binding, providing durability and a professional appearance.
- Q: When was 'Thermal Management of Microelectronic Equipment' published? A: The book was published on January 1, 2002.
- Q: What edition is this book? A: This is the First Edition of 'Thermal Management of Microelectronic Equipment'.
- Q: In which category is this book classified? A: The book is classified under the 'Book Design' category.