Thin Film and Depth Profile Analysis (Topics in Current Physics, 37),Used

Thin Film and Depth Profile Analysis (Topics in Current Physics, 37),Used

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The characterization of thin films and solid interfaces as well as the determina tion of concentration profiles in thin solid layers is one of the fields which re quire a rapid transfer of the results from basic research to technological applica tions and developments. It is the merit of the Dr. Wilhelm Heinrich and Else HeraeusStiftung to promote such a transfer by organizing high standard seminars mostly held at the "Physikzentrum" in Bad Honnef near Bonn. The present book has been stimulated by one of these seminars assembling most of the invited speakers as coauthors. The editor appreciates the cooperation of his colleagues contributing to this book. H. Oechsner Kaiserslautern, April 1984 v Contents 1. Introduction. ByH. Oechsner . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1. 1 Requirements for Thin Film and InDepth Analysis . . . . . . . . . . . . . . . . . . . 1 1. 2 Object and Outl i ne of the Book . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 References 2. The Application of Beam and Diffraction Techniques to Thin Film and Surface MicroAnalysis. By H. W. Werner (With 25 Fi gures) . . . . . . . . . . . . . . . . 5 2. 1 Methods to Determine Chemical Structures in Material Research 5 2. 2 Selected Analytical Features Used to Determine Chemical Structures 9 2. 2. 1 Depth Profi 1 ing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 a) Destructive Depth Profiling b) Nondestructive Methods for Depth and Thin Film Analysis 15 19 2. 2. 2 Microspot Analysis and Element Imaging 2. 3 Determining Physical Structures in Material Research . . . . . . . . . . . . . . . 27 2. 3. 1 XRay Diffraction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2. 3. 2 XRay Double Crystal Diffraction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2. 3.

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