Wafer Bonding,New

Wafer Bonding,New

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SKU: DADAX3540210490
Brand: Springer
Condition: New
$428.57
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The topics include bondingbased fabrication methods of silicononinsulator, photonic crystals, VCSELs, SiGebased FETs, MEMS together with hybrid integration and laser liftoff. The nonspecialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find uptodate information about this fastmoving area, including relevant patent information.

⚠️ WARNING (California Proposition 65):

This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.

For more information, please visit www.P65Warnings.ca.gov.

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