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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield,Used
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The wire bonding bible now revised and expanded! Get the practical knowhow you need to design and evaluate wire bonds engineered with the latest and stillevolving metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you stepbystep how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the handson guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, socalled purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get uptotheminute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.
⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.
- Q: What is the main focus of 'Wire Bonding in Microelectronics'? A: The book primarily focuses on the materials, processes, reliability, and yield of wire bonding in microelectronics, providing practical guidance for designing and evaluating wire bonds.
- Q: How many pages does this book contain? A: The book contains 290 pages, offering comprehensive coverage of wire bonding techniques.
- Q: Who is the author of this book? A: The author of 'Wire Bonding in Microelectronics' is George Harman.
- Q: What is the publication date of the second edition? A: The second edition was published on June 1, 1997.
- Q: Is this book suitable for beginners in microelectronics? A: Yes, the book provides step-by-step guidance that can help beginners understand wire bonding processes.
- Q: What type of binding does this book have? A: The book is bound in hardcover, ensuring durability and longevity.
- Q: What are some common problems addressed in the book? A: The book addresses common issues such as cratering, heel cracks, bond fatigue, and purple plague.
- Q: Does the book include information on new bonding metallurgies? A: Yes, it includes up-to-date details on utilizing new bonding metallurgies and techniques.
- Q: Is there any information about fine pitch SMT in the book? A: Yes, the book covers fine pitch surface mount technology (SMT) and its applications in wire bonding.
- Q: What condition is the book in, according to the listing? A: The book is listed in 'Good' condition, indicating it may show some signs of wear but is still functional.