Title
Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield,Used
Delivery time: 8-12 business days (International)
The wire bonding bible now revised and expanded! Get the practical knowhow you need to design and evaluate wire bonds engineered with the latest and stillevolving metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you stepbystep how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the handson guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, socalled purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get uptotheminute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.
By changing our most important processes and
products, we have already made a big leap forward. This ranges from the
increased use of more sustainable fibers to the use of more
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⚠️ WARNING (California Proposition 65):
This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information, please visit www.P65Warnings.ca.gov.
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To facilitate a smooth return process, a Return Authorization (RA) Number is required for all returns. Returns without a valid RA number will be declined and may incur additional fees. You can request an RA number within 15 days of the original delivery date. For more details, please refer to our Return & Refund Policy page.
Shipping & Returns
Shipping
We ship your order within 2–3 business days for USA deliveries and 5–8 business days for international shipments. Once your package has been dispatched from our warehouse, you'll receive an email confirmation with a tracking number, allowing you to track the status of your delivery.
Returns
To facilitate a smooth return process, a Return Authorization (RA) Number is required for all returns. Returns without a valid RA number will be declined and may incur additional fees. You can request an RA number within 15 days of the original delivery date. For more details, please refer to our Return & Refund Policy page.
Warranty
We provide a 2-year limited warranty, from the date of purchase for all our products.
If you believe you have received a defective product, or are experiencing any problems with your product, please contact us.
This warranty strictly does not cover damages that arose from negligence, misuse, wear and tear, or not in accordance with product instructions (dropping the product, etc.).
Warranty
We provide a 2-year limited warranty, from the date of purchase for all our products.
If you believe you have received a defective product, or are experiencing any problems with your product, please contact us.
This warranty strictly does not cover damages that arose from negligence, misuse, wear and tear, or not in accordance with product instructions (dropping the product, etc.).
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Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.
We accept payments with :
Visa, MasterCard, American Express, Paypal, Shopify Payments, Shop Pay and more.
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Frequently Asked Questions
- Q: What is the main focus of 'Wire Bonding in Microelectronics'? A: The book primarily focuses on the materials, processes, reliability, and yield of wire bonding in microelectronics, providing practical guidance for designing and evaluating wire bonds.
- Q: How many pages does this book contain? A: The book contains 290 pages, offering comprehensive coverage of wire bonding techniques.
- Q: Who is the author of this book? A: The author of 'Wire Bonding in Microelectronics' is George Harman.
- Q: What is the publication date of the second edition? A: The second edition was published on June 1, 1997.
- Q: Is this book suitable for beginners in microelectronics? A: Yes, the book provides step-by-step guidance that can help beginners understand wire bonding processes.
- Q: What type of binding does this book have? A: The book is bound in hardcover, ensuring durability and longevity.
- Q: What are some common problems addressed in the book? A: The book addresses common issues such as cratering, heel cracks, bond fatigue, and purple plague.
- Q: Does the book include information on new bonding metallurgies? A: Yes, it includes up-to-date details on utilizing new bonding metallurgies and techniques.
- Q: Is there any information about fine pitch SMT in the book? A: Yes, the book covers fine pitch surface mount technology (SMT) and its applications in wire bonding.
- Q: What condition is the book in, according to the listing? A: The book is listed in 'Good' condition, indicating it may show some signs of wear but is still functional.